Locations
EVENT Sep 23
ABSTRACT Apr 10
Abstract days left 13
Viewed 957 times

THERMINIC 2020

Fraunhofer Forum: Anna-Louisa-Karsch-Str. 2, 10178 Berlin
Organization: Fraunhofer
Categories: Engineering
Event Date: 2020-09-23 to 2020-09-25 Abstract Due: 2020-04-10

The 26th THERMINIC Workshop will be held in Berlin, the capital of Germany. THERMINIC is the major European Workshop related to thermal issues in electronic components and systems. For academics and industrialists involved in both micro and power electronics this annual event promises to be a very special occasion with a high quality technical programme and exciting social events. We invite delegates to consider submitting abstracts that are related (but not limited) to the following topics in thermal or thermo-mechanical aspects in simulation and experiment:

Thermal Phenomena in Simulation and Experiment:

• Thermal management of electronic components and systems

• Classical and modern thermometry and thermography

• Thermal interface materials and their characterisation

• Thermal modelling and investigation of packages

• Nano-scale heat transfer

• Multi-physics simulation and field coupling

• Electro-thermal modelling and simulation

• CFD modelling and benchmarking

• Advanced thermal materials and technologies

• Numerical methods for multi-scale heat transfer

Electronics Cooling Concepts and Applications:

• Cooling concepts: air, liquid, 2-phase, etc.

• Power electronics

• High temperature electronics

• Solid state lighting / LEDs

• Thermo-electric and sub-ambient cooling

• Novel and advanced cooling technologies

• Heat pipe and vapour chambers

• 3D heterogenous integration and cooling

• Ultra low form factor air cooling

• Novel manufacturing methods

• Cooling for IoT, CPS, mobile, edge computing

• Thermal buffering for computational sprinting

• Battery thermal management

Thermo-Mechanical Reliability:

• Thermo-mechanical reliability

• Prognostics and health monitoring

• Lifetime modelling and prediction

• Damage and fracture mechanics

• Failure analysis and inline inspection by thermal imaging

The technical Programme will include oral talks, poster presentations, special sessions and invited keynote talks given by renowned speakers.

Authors are invited to submit an abstract describing recent work from January 2020.  Abstracts must detail the objectives of the work presented and demonstrate new results. All abstracts will undergo a double-blind review process. There will be best paper and best poster awards. Details on the abstract submission as well as the corresponding template will be available on our website (https://therminic2020.eu/) shortly.

https://therminic2020.eu/

therminic@mcc-events.de

Ajda Omrani