IEEE COINS 2025 - IEEE International Conference on Omni-layer Intelligent Systems
University of Wisconsin–Madison, USA
Organization: IEEE
CALL FOR PAPERS
IEEE International Conference on Omni-layer Intelligent Systems
University of Wisconsin–Madison, USA | August 4-6, 2025
https://coinsconf.com
Important Dates:
Abstract submission: 1 April 2025
Full paper submission: 8 April 2025
Special session, workshop, tutorial proposal submission: 8 April 2025
Acceptance notification: 31 May 2025
Camera-ready submission: 21 June 2025
Are you interested in taking part in shaping and adding new dimensions to the future IoT and AI ecosystem? Do you want to stay ahead and learn about the most prominent digital technologies that are radically shifting the paradigm? Or are you just curious about what IoT, AI, and Big Data are all about and how they impact every aspect of our lives, society, and business?
IEEE COINS (https://coinsconf.com) is the right place to be. IEEE COINS brings together experts in Digital Transformation (from AI and IoT to Cloud, low power design, security, privacy, and robotics) from around the globe.
IEEE COINS includes a multi-disciplinary program, from technical research papers to panels, workshops, and tutorials on the latest technology developments and innovations. IEEE COINS will address all important aspects of the of the IoT/AI ecosystem. IEEE COINS solicits papers and proposals accompanying submissions for presentations in the following topical and vertical tracks:
Topical Area Tracks
1. Internet of Things: From Edge to Cloud
2. Sensing Devices and Systems for AIoT
3. Circuits and Systems (CAS) Designs AIoT
4. Communications and Networking for AIoT
5. Artificial Intelligence, Machine Learning, and Cognitive Computing
6. Distributed Ledger Technologies and Blockchain
7. Low Power Design and Automation
8. Security and Privacy
9. Intelligent Robots and Systems
10. Embedded AI
Vertical Tracks
1. Smart Infrastructure
- Smart City
- Energy and Smart Grids
- Smart Agriculture
- Smart Mobility, Transportation, and Logistics
2. Industry 4.0 and Smart Manufacturing
3. Digital Healthcare and Well-being
Special Tracks
1. Emerging Technologies on Intelligent Systems
2. Generative AI: Systems, Architectures, and Applications
Panels
1. Diversity, Equity, and Inclusion
2. Industrial Talks
3. Workshops/Tutorials
Organizing Committee
General Co-Chairs
Umit Yusuf Ogras, University of Wisconsin-Madison
Amit Singh, University of Essex
Technical Program Co-Chairs
Fatemeh Afghah, Clemson University
Priya Panda, Yale University
Publicity Chair Co-Chair
Aly Sabri Abdalla, Mississippi State University
Nicola Dall'Ora, University of Verona, Italy
Jaeha Kung, Korea University
Sumit K Mandal, IISC Bangalore
Oktay Cetinkaya, Univ. of New Castle
Nicola Dall'Ora
